Samsung Electronics Opens Samsung AI Forum 2023 Showcasing Key Advancements in AI and Computer Engineering

Samsung Electronics Co., Ltd.opened the Samsung AI Forum, at which it shared the latest research achievements in artificial intelligence (AI) and computer engineering (CE), contributing to enhancing the company’s next-generation semiconductor technology.

Kye Hyun Kyung, President and CEO of Samsung Electronics’ Device Solutions (DS) Division, said in his opening remarks, “The spotlight has recently shifted toward Generative AI technology, as it provides us the potential to unlock new solutions and address long-standing challenges. But the need for in-depth research on the safety, trustworthiness, and sustainability of AI is increasing at the same time.” About the event, Kyung added, “We expect this forum — where top global experts have gathered — will be a platform to discuss ways to create a brighter future through AI and semiconductor technologies.”

Samsung Electronics Unveils Industry’s Highest-Capacity 12nm-Class 32Gb DDR5 DRAM, Ideal for the AI Era

Provides double the capacity of 16Gb modules within the same package size, enabling 128GB DRAM module production without the TSV process, and decreasing power consumption by 10%

The new product also paves way to DRAM modules of up to 1TB capacity

With the expanded lineup of 12nm-class DRAM, Samsung will continue its collaboration with diverse industries and support various applications

Samsung Electronics Co., Ltd., a world leader in advanced memory technology, announced that it has developed the industry’s first and highest-capacity 32-gigabit (Gb) DDR5 DRAM¹ using 12 nanometer (nm)-class process technology. This achievement comes after Samsung began mass production of its 12nm-class 16Gb DDR5 DRAM in May 2023. It solidifies Samsung’s leadership in next-generation DRAM technology and signals the next chapter of high-capacity memory.

Cadence Expands Collaboration with Samsung Foundry, Providing Differentiated Reference Flows Based on the Integrity 3D-IC Platform

• Companies advance multi-die planning and implementation, leveraging Cadence’s Integrity 3D-IC platform, the industry’s only unified platform that combines system planning, packaging and system-level analysis

• Integrity 3D-IC platform supports Samsung’s new 3D CODE standard, enabling designers to create a variety of advanced packaging technologies

• Cadence and Samsung technologies provide customers with comprehensive, customized solutions for diverse configurations that reduce the overall 3D-IC design development time for 5G, AI, hyperscale, IoT and mobile applications

Cadence Design Systems, announced an expanded collaboration with Samsung Foundry to accelerate 3D-IC design development for next-generation applications like hyperscale computing, 5G, AI, IoT and mobile. This latest collaboration advances multi-die planning and implementation with the delivery of the latest reference flows and corresponding package design kits based on the Cadence Integrity^™ 3D-IC platform, the industry’s only unified platform that includes system planning, packaging and system-level analysis in a single cockpit. In addition, the Integrity 3D-IC platform supports Samsung’s new 3D CODE standard, a new system description language that simplifies the definition and interoperability of design creation and analysis flows in a unified environment.

Samsung Develops Industry’s First CXL DRAM Supporting CXL 2.0

Samsung Electronics Co. Ltd, a world leader in advanced semiconductor technology, announced its development of the industry’s first 128-gigabyte (GB) DRAM to support Compute Express Link 2.0. Samsung worked closely with Intel on this landmark advancement on an Intel Xeon platform.

“As a member of the CXL Consortium Board of Directors, Samsung Electronics remains at the forefront of CXL technology,” said Jangseok Choi, vice president of New Business Planning Team at Samsung Electronics. “This breakthrough development underlines our commitment to expanding the CXL ecosystem even further through partnerships with data center, server and chipset companies across the industry.”

Samsung Electronics and AMD Extend Strategic IP Licensing Agreement to Bring AMD Radeon Graphics to Future Mobile Platforms

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, and AMD announced they have signed a multi-year agreement extension to bring multiple generations of high-performance, ultra-low-power AMD Radeon graphics solutions to an expanded portfolio of Samsung Exynos SoCs. Through the licensing extension, Samsung will bring console-level graphics quality and optimized power consumption to more mobile devices, offering an incredibly immersive and long-lasting gaming experience.

“Together with AMD, Samsung has been revolutionizing mobile graphics, including our recent collaboration that brought ray tracing capability to mobile processors for the first time in the industry,” said Seogjun Lee, executive vice president of Application Processor (AP) Development at Samsung Electronics. “Drawing on our technological know-how in designing ultra-low-power solutions, we will continue to drive ongoing innovation in the mobile graphics space.”

Samsung Electronics Introduces Standardized 5G NTN Modem Technology to Power Smartphone-Satellite Communication

Standardized 5G NTN technology simulated on Samsung’s Exynos Modem 5300;

Demonstrates two-way text messaging as well as image and video sharing

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, announced that it has secured standardized 5G non-terrestrial networks (NTN) modem technology for direct communication between smartphones and satellites, especially in remote areas. Samsung plans to integrate this technology into the company’s Exynos modem solutions, accelerating the commercialization of 5G satellite communications and paving the way for the 6G-driven Internet of Everything (IoE) era.

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“This milestone builds on our rich legacy in wireless communications technologies, following the introduction of the industry’s first commercial 4G LTE modem in 2009 and the industry’s first 5G modem in 2018,” said Min Goo Kim, executive vice president of CP (Communication Processor) Development at Samsung Electronics. “Samsung aims to take the lead in advancing hybrid terrestrial-NTN communications ecosystems around the world in preparation for the arrival of 6G.”

VMware Collaborates with Samsung on Virtualized RAN to Pave Way for Open 5G Networks

Mobile World Congress 2023 VMware,announced an expanded collaboration with Samsung resulting in the integration of Samsung’s O-RAN compliant virtualized RAN solutions and VMware Telco Cloud Platform as part of the DISH Wireless 5G network buildout. This milestone advances the ongoing efforts between the two companies to enable Communication Service Providers (CSPs) to gain the full benefits of Open RAN networks.

VMware and Samsung announced their global 5G collaboration in 2020, and have since co-developed a validated architecture and cell site deployment model integrating the Samsung virtualized Distributed Unit (vDU) running on top of the VMware Telco Cloud Platform. This advanced topology is tested and fully interoperable, and can help CSPs accelerate and streamline their RAN deployments at scale while reducing network costs. The joint topology provides the flexibility to support a diverse ecosystem of partners.

Samsung Electronics’ World-Class 5nm Technology Selected by Ambarella for New Automotive AI Central Domain Controller

New CV3-AD685 System-on-Chip advances Autonomous and Advanced Driver Assistance System (ADAS) applications, providing single-chip solution for multi-sensor fusion and path planning

Samsung Electronics, a world leader in advanced semiconductor technology, and Ambarella, an edge AI semiconductor company, announced that Samsung’s Foundry business is providing its 5-nanometer (nm) process technology to Ambarella for its newly announced CV3-AD685 automotive AI central domain controller. This collaboration will help transform the next generation of autonomous driving vehicle safety systems by bringing new levels of AI processing performance, power and reliability.

“Samsung brings 5nm EUV FinFET technology to automotive applications for unprecedented ADAS and vision processor performance,” said Sang-Pil Sim, executive vice president and head of Foundry Corporate Planning at Samsung Electronics. “With Tier-1 automotive suppliers already adopting the technology, we believe other automotive companies will also consider using the Ambarella CV3-AD SoC product family manufactured in Samsung’s 5nm process.”

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Samsung and Sprinklr Partner to Reinvent the Shopping Experience

Sprinklr the unified customer experience management (Unified-CXM) platform for modern enterprises, announced that Sprinklr is now an official Software Partner for Samsung, an industry leader in the global display market. As a Software Partner, the Sprinklr platform is now available as an integrated app for Samsung SMART Signage and Hospitality Displays.

“Shoppers expect to receive a positive first impression when interacting with a brand. These rising customer expectations are prompting retailers to rely on Samsung to create meaningful experiences for their customer base through the use of display technologies in their stores,” said Parrish Chapman, Director, Enterprise Retail Sales Key Accounts at Samsung Electronics America. “Our partnership with Sprinklr helps our retail customers meet this mission by consolidating social media content, promotions and reviews that are updated in real-time while consumers are shopping.”

Winding Up